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An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB3.0 system interface and an M-PHY interface, wherein the SSIC is configured to issue remote register access protocol (RRAP) commands through a local M-PHY to a remote M-PHY in a low speed burst mode. Technical Field The present invention relates to the use of inter-chip communications in devices using the SuperSpeed inter-chip (SSIC)

Chip Factory Time Limit: 18000/9000 MS (Java/Others) Memory Limit: 262144/262144 K (Java/Others) Total Submission(s): 1842 Accepted Submission(s): 833 Problem Description John is a manager of a CPU chip factory, the factory produces lots of chips everyday. To manage large amounts of products, every processor has a serial number. More specifically, the factory produces chips today, the -th chip produced this day has a serial number . At the end of the day, he packages all the chips produced this day, and send it to wholesalers. More specially, he writes a checksum number on the package, this

Chip Factory Time Limit: 20 Sec Memory Limit: 256 MB 题目连接 http://acm.hdu.edu.cn/showproblem.php?pid=5536 Description John is a manager of a CPU chip factory, the factory produces lots of chips everyday. To manage large amounts of products, every processor has a serial number. More specifically, the factory produces n chips today, the i-th chip produced this day has a serial number si. At the end of the day, he packages all the chips produced this day, and send it to wholesalers. More specially, he writes a checksum number on the package, this checksum is defined as below: maxi,j,k(si+sj)⊕sk

了解PWM基础知识。 1.Introduction   Pulse Wide Modulation (PWM) operates like a switch that constantly cycles on and off. It is a hardware feature used to control servomotors, for voltage regulation, and so on. The most wellknown applications of PWM are: Motor speed control Light dimming Voltage regulation Now, let us introduce PWM with a simple following figure:   The preceding figure describes a complete PWM cycle, introducing some terms we need to clarify prior to getting deeper into the kernel PWM framework: Ton: This is the duration during which the signal is high. Toff: This is the duration

bug: msm8953 lcd在快速亮灭的情况下背光概率性休眠不灭；测量高通pwm，发现正常的时候pwm的管脚 LCM_BL_PWM 为低电平，失败的时候为高电平； mpp是什么？ mpp是基于电源pmic的管脚，也叫做多功能管脚；MPP的全称是Multi Purpose Pin；可以做电源、gpio、ADC、PWM、SINK等功能。 背光控制的方式： LCD控制IC支持动态背光控制功能（CABC）通过解析图像的直方图动态改变输出PWM的占空比从而动态调节LCD的背光，在不改变图像显示效果的情况下降低功耗，PMIC根据CABC的占空比控制背光输出电压； 背光控制部分不经过PMIC而是通过一颗单独的带有boost转换功能的LED驱动器如LM3630A，该芯片通过PWM调节亮度。 我们使用的就是第一种方式； 通过soc->pmi8950(内部pwm)->mpp3的方式去控制。 背光控制的调用流程： 首先，我们用的是mipi接口，所以lcd显示驱动是在mdss_dsi.c中，pwm驱动控制是在pwm-qpnp.c文件中(kernel\msm-3.18\drivers\pwm); 在mdss_dsi.c文件中，具体在哪里调用到背光函数呢？ 根据打印log，可以知道背光控制函数mdss_dsi_panel_bl_ctrl； mdss_dsi_panel_bl_ctrl这个函数是在mdss

1. 传统多芯片模块封装技术 Die 2 Die的通信是通过基板电路实现的，优点是可靠，缺点是集成的密度比较低。是一种非常原始的方式。 例子：amd Naples 的四个Chiplet之间的通信也是使用这种方式。 2. 使用硅中介层的封装技术 -2.5D封装 Silicon Interposer 起承上启下的作用 缺点是：增加了厚度，增加了成本，所有Die出去的型号都要通过TSV技术过孔原本不必要，增加了成本。 目前工业界大部分的单封装的处理器基本都是这种封装技术。 例子：某GPU， 左侧是计算引擎，右侧是堆叠的HBM内存，两者使用的是硅中介的方式互联。 3. EMIB Embedded Multi-Die Interconnect Bridge 嵌入式多芯片互联封装技术-intel专有的2.5D封装 取消了中介，只增加一种桥叫做Silicon Bridge； 优点是：没有中介层不增加封装厚度；Die2Die通信才走Bridge，其他的走封装基底，不需要TSV，降低了成本；Die2Die更近，速度更高，损耗更小； 例子：Intel的FPGA产品 Stratix使用了EMIB将自己的计算核心和内存芯片联系在一起。 4. Foveros封装技术，英特尔专用2019年才有概念。 为了应对AMD的核心暴增，在一个大芯片上集成多核难度越来越大，未来的趋势肯定是Chiplet互联的方式

一、linux中断注册 1、request_irq函数 request_irq 函数就是驱动开发者向内核注册一个中断的接口。它有五个参数，分别是响：中断号，应中断时的中断处理函数，中断的触发方式，中断的名字，传给中断处理的参数。代码块如下: /********************************************************* * irq : 中断号 * handler : 中断处理函数 * irqflags : 中断的触发方式 * devname : 中断名称 * dev_id : 传给中断服务函数的参数 *********************************************************/ int request_irq(unsigned int irq, irq_handler_t handler, unsigned long irqflags, const char *devname, void *dev_id) { struct irqaction *action; int retval; #ifdef CONFIG_LOCKDEP /* * Lockdep wants atomic interrupt handlers: */ irqflags |= IRQF_DISABLED; #endif /* *

一、中断作用 Linux 内核需要对连接到计算机上的所有硬件设备进行管理。如果要管理这些设备，首先得和它们互相通信才行。 一般有两种方案可实现这种功能: 轮询（polling） 让内核定期对设备的状态进行查询，然后做出相应的处理； 中断（interrupt） 让硬件在需要的时候向内核发出信号（变内核主动为硬件主动）。 使用轮询的方式会占用CPU比较多的时间，效率极低。例如:要读取一个按键有没有被按下时，一个进程需要不断地查询按键有没有被按下。这样这个任务就占用CPU大量得时间,使得CPU做了大量的无用功。使用中断提供这样的一个机制。当按键没有被按下的时候，挂起当前进程，将控制权转交给其他进程。当按键按下的时候，操作系统把当前进程设为活动的，从而允许该进程继续执行。 二、linux中断管理 linux 内核将所有的中断统一编号，使用一个 irq_desc 结构体数组描述中断。一个数组项对用一个中断(或者是一组中断，它们共用中断号)。 struct irq_desc 结构体记录了，中断的名称、中断状态，底层硬件访问接口(使能中断，屏蔽中断，清除中断)，中断处理函数的入口， 通过它可以调用用户注册的中断处理函数。 1、struct irq_desc struct irq_desc 在 include\linux\irq.h 文件里面定义 struct irq_desc { irq

可以将文章内容翻译成中文,广告屏蔽插件可能会导致该功能失效(如失效，请关闭广告屏蔽插件后再试): 问题: I have a ESP8266 chip which is connected to the microcircuit. When chip gets value "200" the light is starting to blink 4 times and than it returns "100" value. I need to make an Android app using Java which will connect to the ESP8266 chip, send data to it and will get value "100". I don't know what library I should use to deal with it. Please, help me, how can I do that? I think it is not the most hard question here. 回答1: For your Controller you dont need any Libary. You just can use the serial AT Commands: http://www.electrodragon.com/w

可以将文章内容翻译成中文,广告屏蔽插件可能会导致该功能失效(如失效，请关闭广告屏蔽插件后再试): 问题: I know that l1 and l2 caches are levels in multi-level cache. I would like to know where each level cache is placed, and what is the maximum number of cache levels allowed? 回答1: Both of these depend on the CPU. There are CPUs which have no cache at all, there are CPUs which have the L1 cache on die and the L2 cache on a separate die on the same chip or even on a separate chip, or there are CPUs which have both L1 and L2 cache on the same die as the CPU core. There are multi-core, multi-chip CPUs where each core has its own L1 cache on die,